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Difference between revisions of "Fluid Bed Coolers"
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[[File:Open circuit fluid bed cooler.gif|thumb|right|Open circuit Fluid Bed Cooler]] | [[File:Open circuit fluid bed cooler.gif|thumb|right|Open circuit Fluid Bed Cooler]] | ||
Fluid | '''Fluid Bed Cooler''' technology is used for cooling, heating and drying of bulk solids materials. Fluid bed heat exchange takes place by passing a gas (most commonly air) through a perforated distributor plate which then flows through a layer (bed) of solids. The air performs two functions. First, the air flows through the bed of solids at a velocity sufficient to support the weight of the particles, which creates a fluidized state enabling the particles to flow. Second, the air in the fluid bed serves to cool, heat or dry the particles as it comes into direct contact with the solids material within the fluid bed chamber. | ||
The premise behind fluid bed technology for cooling and heating is that large volumes of air are used to both fluidize the material (required to enable the product to flow) and to act as the heat exchange medium – adding or removing heat from the process. | The premise behind fluid bed technology for cooling and heating is that large volumes of air are used to both fluidize the material (required to enable the product to flow) and to act as the heat exchange medium – adding or removing heat from the process. | ||