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Difference between revisions of "Thermal Calculations"
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[[File:Thermal calculation for cabinet cooling.jpg|thumb|right|Thermal calculation for cabinet cooling]] | |||
'''Thermal Calculation''' is used to estimate the junction temperatures of components which use exposed-pad packages. | |||
The data used in the thermal calculator is generated from measured laboratory data combined with thermal-modeling analysis that uses a series of thousands of data points.The result of the correlation is used to create the curves and the data points that appear in the thermal calculator.The thermal calculator also supports the input of the board temperature as a reference point. In this case, the junction temperature results are estimated independently . | |||